众所周知,塑封时产生的压力会引起芯片带隙基准电压一定的漂移,并且这种漂移与塑封料和工艺有密切关系,尤其是经历高温吸潮后这种漂移更加明显。本文以计量芯片为例,介绍了一种减少塑封对芯片带隙基准电压漂移的方法即芯片上增加一层10-15um厚度的柔性材料———polyimide(聚酰亚胺)。 As we all know, the pressure generated when molding will cause the chip bandgap reference voltage drift, and this drift is closely related with plastic materials and processes, especially after experiencing high temperature moisture absorption such drift more obvious. In this paper, a measurement chip is taken as an example to introduce a method of reducing the band gap reference voltage drift of a plastic package by adding a layer of flexible material (polyimide) with a thickness of 10-15um on the chip.