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热熔法制备了一系列聚苯基甲氧基硅氧烷(PPMS)、聚甲基苯基甲氧基硅氧烷(PMPS)改性环氧树脂,通过环氧值、红外光谱(IR)分析表明聚硅氧烷接枝了E-20环氧树脂且环氧基保持不变.探讨了有机硅含量对改性树脂固化体系耐热性能及韧性的影响.实验表明,当E-20环氧树脂与PPMS、PMPS的质量比为7∶3时,改性树脂固化体系的耐热性能明显提高,玻璃化转变温度(Tg)为95.8、88.3℃,分别比改性前提高了9.0℃和1.5℃;质量损失50%时的热分解温度(Td)为476.5、487.8℃,分别比改性前提高了58.3℃和69.5℃.与ED-30固化体系相比,EPMS-30固化物的耐热性能,韧性等力学性能提高的更加明显,并且还具有优良的涂膜性能.
A series of polyphenylmethoxy siloxane (PPMS) and polymethylphenylmethoxysiloxane (PMPS) modified epoxy resin were prepared by hot melt method. Epoxy, The results showed that the polysiloxane grafted E-20 epoxy resin and the epoxy group remained unchanged.The effect of silicone content on the heat resistance and toughness of the modified resin cured system was discussed.The experiment shows that when the E-20 ring When the mass ratio of oxygen resin to PPMS and PMPS is 7: 3, the heat resistance of the modified resin curing system is obviously improved, the glass transition temperature (Tg) is 95.8 and 88.3 ℃, respectively, 9.0 and 1.5 ℃, respectively.The thermal decomposition temperature (Td) of the mass loss 50% was 476.5 and 487.8 ℃, respectively, 58.3 ℃ and 69.5 ℃ higher than those of the former ED-30 curing system Thermal properties, toughness and other mechanical properties increased more obvious, and also has excellent coating performance.