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系统封装(System In Packaging)是电子封装工艺的前沿技术。为了研究这种高密度电子封装器件的热特性,寻求提高散热速率的途径,开发了一个SIP典型器件的传热模型,模拟了器件的热传递过程和温度分布状况,探讨了各种设计参数和物性参数对温度场的影响,为进一步改善器件的热性能提供了理论依据。
System In Packaging is a cutting-edge technology for the electronics packaging process. In order to study the thermal characteristics of high-density electronic packaging devices and seek ways to improve the heat dissipation rate, a heat transfer model of SIP typical devices was developed to simulate the heat transfer process and temperature distribution of the devices. Various design parameters and The influence of physical parameters on the temperature field provides a theoretical basis for further improving the thermal performance of the device.