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本文首次采用热闭环亚胺化法由已撑双马来酰胺酸合成已撑双马来酰亚胺并直接聚合成聚合物.热闭环亚胺化不用脱水剂、工艺路线短、收率高,是对Elliat等人建立的化学闭环亚胺化的一大改进.用端基测定法对热闭环亚胺化反应的条件作了分析,推算了反应的活化能.根据热闭环亚胺化反应与闭环产物热引发聚合反应活化能的差值设计了在一次反应中直接聚合的方法.本文还对聚合物的热、电性能作了测定.并用聚合产物作H级浸渍漆对电机作了浸渍试验.
In this paper, the first thermal closed-loop imidization was carried out by the bis-maleamic acid has been supported bismaleimide polymerization and polymerization directly into the polymer.His closed loop imidization without dehydrating agent, the process route is short, high yield, Is a great improvement of chemical closed-loop imidization established by Elliat et al.Analysis of the conditions of the imidization of the thermal cyclotron by the end-group method and the activation energy of the reaction are deduced.According to the thermal cyclotronization reaction and The difference between the activation energies of the ring-initiated thermal-initiated polymerization reaction was designed to directly polymerize in a single reaction.The thermal and electrical properties of the polymer were also measured.The impregnation test .