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在近代电子工业中,用光学投影法制作微米或亚微米图形时,要求感光材料层与投影镜头之间相对距离的偏差(焦深精度)在±1微米以内。而照相所用的干版,由于玻璃片基本身的不平度就往往大于此值,因此很难保证焦深不失调。本文介绍用于这一工艺过程的气动自动监测、跟踪自动调焦系统的结构原理、计算方法及实验结果。根据这一原理制成的自动调焦仪,我校于1974年投入生产。经长期生产使用,证明工作稳定可靠,在200微米跟踪范围内,调焦误差小于±2微米,在100微米范围内,跟踪精度(3σ)可达到±1微米。本系统也可用于照相干版、半导体硅片的平面度或其它表面不平度的非接触自动测量,以及带状产品的自动连续测量。
In the modern electronics industry, the use of optical projection to produce micrometer or sub-micrometer patterns requires a deviation (depth-of-focus accuracy) of ± 1 micrometer from the relative distance between the photographic material layer and the projection lens. The photographic dry version, due to the basic glass body roughness is often greater than this value, it is difficult to ensure that the depth of focus is not out of tune. This article describes the pneumatic automatic monitoring process used in this process, tracking the structure principle, calculation method and experimental results of the autofocus system. According to this principle made of automatic focusing instrument, our school put into production in 1974. Long-term production and use, to prove that the work is stable and reliable, in the 200-micron tracking range, focusing error of less than ± 2 microns, 100 microns, tracking accuracy (3σ) up to ± 1 microns. The system can also be used for non-contact automatic measurement of photographic plates, flatness of semiconductor wafers or other surface irregularities, and automatic continuous measurement of ribbons.