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四机部半导体专业情报网组织召开的《切磨抛技术交流会》于1980年5月13日至18日在重庆召开.来自全国各厂、所、院校等116个单位的178名代表参加了会议.会议共收到资料96篇,其中36篇在大会上进行了交流.这次交流会就硅及GaAs切磨抛的工艺、设备和硅片质量检验等进行了广泛交流.从交流情况看,切磨抛设备、抛光布及SiO_2抛光液均有从国外引进和国产工种.与会代表
Four Machine Ministry of semiconductor professional intelligence network organized by the “cut grinding and polishing technology exchange meeting” May 13, 1980 to 18 in Chongqing held in. From all factories, institutes and other 116 units of 178 representatives to participate The meeting received a total of 96 materials, of which 36 were exchanged at the General Assembly, the exchange on silicon and GaAs cutting polishing process, equipment and wafer quality inspection conducted a wide range of exchanges from the exchange of information Look, cut grinding throwing equipment, polishing cloth and SiO 2 polishing liquid are imported from abroad and domestic work.