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本文提出一种简便精确测量热阻的方法,测量了集成电路的结温和热阻。通过几种状态的测量比较,对常用的红外辐射测试结温的方法进行了讨论,並指出其局限性。这方法也适用于多种电路。
This article presents a simple and accurate method for measuring thermal resistance, measuring the junction temperature and thermal resistance of integrated circuits. Through the comparison and measurement of several states, the commonly used method of testing the junction temperature of infrared radiation is discussed and its limitation is pointed out. This method also applies to a variety of circuits.