采用职业卫生现场调查和职业病危害因素检测相结合的方法,根据危害分析与关键控制点(HACCP)理论,对苏州高新区2家生产多层线路板的大型电子企业进行职业病危害关键控制点分析。结果显示,多层线路板制造行业主要存在氰化物、镍及其化合物、氨、甲醛、硫酸、盐酸、氢氧化钠、铅烟、生产性粉尘、噪声和X射线等职业病危害因素,压合、电镀铜、表面处理、喷锡等车间为职业病危害关键控制点。 According to the method of field investigation of occupational health and detection of occupational hazards, according to the hazard analysis and critical control point (HACCP) theory, two key control points of occupational hazards in large-scale electronics enterprises producing multilayer circuit boards in Suzhou Hi-tech Zone were analyzed. The results show that there are mainly occupational hazards such as cyanide, nickel and its compounds, ammonia, formaldehyde, sulfuric acid, hydrochloric acid, sodium hydroxide, lead smoke, productive dust, noise and X-ray in multilayer PCB manufacturing industry. Electroplating copper, surface treatment, such as spraying tin workshop occupational hazards critical control point.