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采用粉末冶金法制备了不同体积分数的纳米MgO颗粒增强铜基复合材料,测定了MgO/Cu复合材料的密度、硬度和电导率,并进行了微观组织观察。结果表明,随着MgO颗粒含量的增加,MgO/Cu复合材料的密度和电导率降低,硬度先升高后降低,当MgO体积分数达到2.5%时,综合性能最好。微观组织观察表明,热挤压后,增强相颗粒弥散分布在铜基体上;随着增强相体积分数的增加,颗粒出现团聚并聚集在铜基体晶界处。
The nano-MgO particles reinforced copper matrix composites with different volume fraction were prepared by powder metallurgy method. The density, hardness and electrical conductivity of MgO / Cu composites were measured and the microstructure was observed. The results show that with the increase of MgO content, the density and electrical conductivity of MgO / Cu composites decrease. The hardness increases first and then decreases. When the volume fraction of MgO reaches 2.5%, the composite properties are the best. Microstructure observation shows that after hot extrusion, the reinforcing phase particles disperse and distribute on the copper matrix. With the increase of the volume fraction of the reinforcing phase, the particles agglomerate and gather at the grain boundaries of the copper matrix.