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以微螺旋碳纤维(CMCs)作为复合材料的导电填料,以高密度聚乙烯(HDPE)作为复合材料的基体树脂,研究了CMCs/HDPE基复合材料的电渗流行为、渗流阈值附近复合材料的导电机制。结果表明:CMCs/HDPE复合材料存在明显的渗流行为,其渗流阈值为6.28%(CMCs的体积分数)或9.77%(CMCs的质量分数);当CMCs的体积分数接近于渗流阈值时,CMCs/HDPE复合材料的导电方式由隧道效应所致。
The electroosmotic flow behavior of CMCs / HDPE-based composites was investigated by using micro-spiral carbon fibers (CMCs) as the conductive filler and HDPE as the matrix resin. The electrical conductivity of the composites near the percolation threshold . The results show that the CMCs / HDPE composites have obvious percolation behavior, the percolation threshold is 6.28% (volume fraction of CMCs) or 9.77% (mass fraction of CMCs). When CMCs volume fraction is close to percolation threshold, Conductive composite materials by the tunnel effect.