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在大多数移动通信装置的寿命中最常见的故障是通过跌落撞击产生的。这是当今通过跌落撞击测试的方法测得的,该方法已经通过了JEDEC标准。然而这种方法相当耗时,且复验性方面还存在着一些问题。报道的研究是在与焊凸冷拉相关联的跌落撞击测试情况下完成的,这两者之间可以替代。本研究方法旨在了解引起故障的机械负载,并不仅仅是适合于数据。因此,跌落撞击测试便成为一种模式并备用来验证这一模式的试验,它将成为未来的处理方式。完成的焊凸冷拉测试研究证实,该测试未将焊凸偏移至一种确定的故障模式,测试研究的结果以及有关焊凸的模拟情况一并作了阐述。两种测试似乎是测试了相同的现象,根据来自CBP(cold bump pull)的结果表明与跌落撞击测试的情况相同,但由于模拟和试验工作尚未完全结束,其中的详情暂无法提供。
The most common failure in the life of most mobile communication devices is by drop impact. This is measured by the drop impact test today, which has passed the JEDEC standard. However, this method is rather time-consuming, and there are still some problems with retest. The reported study was done with a drop impact test associated with bump cold pull, which can be substituted for the two. This research approach aims to understand the mechanical loads that cause the failure and is not just suitable for the data. Therefore, the drop impact test becomes a model and is backed up to validate this mode of testing, which will be the way to handle it in the future. The completed bump cold-pull test study confirmed that the test did not shift the bump to a certain failure mode, the results of the test study and the simulation of bump are also described. Both tests seem to be testing the same phenomenon, and the results from the cold bump pull (CBP) show the same as the drop impact test, but details of the simulation and test work are not yet available.