介绍了目前最为先进的 MCM(Multi-Chip Module多芯片模块 )技术 ,通过与传统封装技术的对比 ,介绍了 MCM技术的特点。重点讨论了 MCM技术最为关键的芯片互连技术 The current most advanced MCM (Multi-Chip Module) technology is introduced, and the characteristics of the MCM technology are introduced by comparing with the traditional packaging technology. Focus on the MCM technology is the most critical chip interconnect technology