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制备了挠性印制电路中铜箔与聚酰亚胺基材间的聚酰亚胺粘接材料,由醚酐、脂肪族二胺和4,4’-二氨基二苯醚(ODA)或杂环芳香二胺共聚得到的聚酰亚胺薄膜的成膜性很好。通过红外分析,含ODA聚酰亚胺和含杂环聚酰亚胺薄膜已酰亚胺化完全。其力学性能较好。通过DSC分析,含ODA聚酰亚胺的玻璃化转变温度为141℃,结晶熔融温度为212℃;含杂环聚酰亚胺的玻璃化转变温度为136℃,并在225℃出现了一个吸热峰。采用含ODA或杂环聚酰亚胺胶粘剂制备的双面挠性印制电路基板的平均剥离强度为828．66N／m及710．98N／m。
A polyimide adhesive material between a copper foil and a polyimide substrate in a flexible printed circuit was prepared. The polyimide adhesive consisted of an ether anhydride, an aliphatic diamine and 4,4’-oxydianiline (ODA) or The polyimide film obtained by copolymerizing heterocyclic aromatic diamine has good film-forming property. By IR analysis, the ODA-containing polyimide and heterocyclic-containing polyimide film have been imidized completely. Its mechanical properties are better. By DSC analysis, the glass transition temperature of the ODA-containing polyimide was 141 ° C., the crystal melting temperature was 212 ° C., the glass transition temperature of the heterocyclic polyimide was 136 ° C., and a suction occurred at 225 ° C. Hot peak. The average peel strength of the double-sided flexible printed circuit boards prepared using the ODA-containing or heterocyclic polyimide adhesive was 828.66 N / m and 710.98 N / m.