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多功能系统集成封装 System-on-packaging integrates multiple tasks “系统封装”可以认为是摩尔定律概念在封装系统上的一个范例,最近美国乔治亚州工学院的PRC中心对此进行了研究。系统级别的封装采用—个器件取代了原来上百个元件的组合功能,它可以实现运算、存储等功能,而其尺寸不比平常所见的奔腾微处理器大,文中对MCM、SiP、SoP等封装形式的特点进行了比较研究,对未来光
System-on-packaging integrates multiple tasks. System encapsulation can be considered as an example of the concept of Moore’s Law on packaging systems. Recently, the PRC Center of the Georgia Institute of Technology in the United States studied this. The system-level package uses a device that replaces the original combination of hundreds of components, it can achieve computing, storage and other functions, and its size is not larger than the usual Pentium microprocessor, the text of MCM, SiP, SoP, etc. The characteristics of the package were compared with the light of the future