论文部分内容阅读
采用真空熔敷法在纯钨表面制备Cu-Ni-Fe涂层,以此涂层为中间层,实现纯钨与铜的扩散连接。利用光学显微镜、扫描电镜、能谱仪、显微硬度计及剪切试验等方法,研究钨/Cu-Ni-Fe涂层/铜连接接头的界面显微组织特征及成分分布。结果表明:真空熔敷所形成的钨/Cu-Ni-Fe涂层界面中,大量W原子以反应扩散形式进入Cu-Ni-Fe涂层,形成宽约6μm的界面富FeW层;后续扩散连接所形成的Cu-Ni-Fe涂层/铜界面中,除了母材紫铜中存在少量微孔外,界面组织均匀致密;钨/Cu-Ni-Fe涂层/铜连接接头的剪切强度达到185MPa,断裂失效发生在钨母材和界面富FeW层中。
The vacuum welding method was used to prepare Cu-Ni-Fe coating on the surface of pure tungsten. The coating was used as an intermediate layer to achieve diffusion bonding between pure tungsten and copper. The microstructure and composition distribution of the interface of tungsten / Cu-Ni-Fe coating / copper joint were studied by optical microscopy, scanning electron microscopy, energy dispersive spectrometer, microhardness tester and shear test. The results show that a large number of W atoms enter the Cu-Ni-Fe coating by reactive diffusion in the interface of tungsten / Cu-Ni-Fe coating formed by vacuum deposition, forming an interface-rich FeW layer with a width of about 6μm. In the Cu-Ni-Fe coating / Cu interface, the microstructure of the Cu-Ni-Fe coating / Cu interface is uniform and compact except for the presence of a few micropores in the parent material Cu. The shear strength of the Cu / Ni- Fracture failure occurs in the tungsten matrix and in the interface-rich FeW layer.