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利用非平衡多靶溅射沉积法在不同脉冲偏压、沉积速率下制备了Ti-Nb-Ni薄膜,用X射线衍射(XRD)、扫描电镜(SEM)、透射电子显微镜(TEM)和电化学极化试验分析了薄膜结构和抗腐蚀性能。结果表明,在0V偏压下,当Ti:Nb:Ni沉积速率比为3:1.5:1.5时,为晶化薄膜;而当Ti沉积速率的控制电流在5～7A范围内,Nb、Ni沉积速率不变时,为非晶薄膜。对于沉积速率比为5:1.5:1.5的薄膜,当偏压从0V增加到–2000V时,薄膜组织的演化过程为非晶-弥散小晶粒-致密小晶粒-大颗粒晶粒。电化学极化试验表明,利用非晶化和晶化复合工艺获得的Ti-Nb-Ni薄膜具有更好的耐腐蚀性能。
Ti-Nb-Ni thin films were prepared by unbalanced multi-target sputtering deposition at different pulse bias and deposition rates. The films were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM) Polarization tests analyzed the film structure and corrosion resistance. The results show that when the deposition rate of Ti: Nb: Ni is 3: 1.5: 1.5, the film is crystallized under the bias of 0V. When the control current of Ti deposition rate is in the range of 5 ~ 7A, the deposition of Nb and Ni The same rate, amorphous film. For the films with a deposition rate ratio of 5: 1.5: 1.5, the evolution of the film structure is amorphous-diffuse small grains-dense small grains-large grains when the bias voltage increases from 0V to -2000V. Electrochemical polarization experiments show that the use of amorphous and crystallization of Ti-Nb-Ni composite film has better corrosion resistance.