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以铜为基体,采用电镀镍和浆料包渗铝法,在800°C渗铝12 h制备出组织为Ni2Al3的单相渗层。采用SEM、XRD和光学显微镜,研究在1000°C下空气中氧化25~250 h,Ni2Al3渗层的高温抗氧化性能与组织转变行为。结果表明:Ni2Al3渗层在1000°C氧化250 h后,氧化增重分别为纯铜和镍镀层的1/15和1/2。氧化时间在25 h内时,渗层表面仍有Ni2Al3相;氧化50 h后,出现NiAl相;当氧化时间增加到100 h时,Ni2Al3相完全转变为NiAl相。当氧化到250 h时,渗层仍具有良好的抗高温氧化性能。
Taking copper as the base, single-phase diffusion layer with the structure of Ni2Al3 was prepared by aluminum plating at 800 ° C and aluminizing at 800 ° C. The high temperature oxidation resistance and microstructure of Ni2Al3 layer were studied by SEM, XRD and optical microscope at 25 ℃ for 25 ~ 250 h in air at 1000 ° C. The results show that after oxidation at 1000 ° C for 250 h, the oxidation weight gain of Ni2Al3 layer is 1/15 and 1/2 of those of pure copper and nickel. When the oxidation time is within 25 h, the Ni2Al3 phase is still present on the surface of the diffusion layer. After the oxidation for 50 h, the NiAl phase appears. When the oxidation time increases to 100 h, the Ni2Al3 phase completely changes to the NiAl phase. When oxidized to 250 h, the diffusion layer still has good high temperature oxidation resistance.