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尽管几种表面处理都增加了铜和陶瓷的结合力,但最有希望的还是利用熔融的NaOH——这是依据J.G.Ameen,A.W.Gillis,C.E.Samuelson和G.P.Vlask的发明—他们几人都是IBM公司的。在十天的实验中,他们检查了各工序(由G.V.Elmore发明的),并且证实了它们一些更重要的特性。他们的实验表明,用熔融NaOH浸泡过的陶瓷基片,再经过用标准的化学镀和电解工艺来电镀,使铜和陶瓷的结合强度由2.75磅增加到8磅以上。检查一下在NaOH中处理并经过弯曲试验的陶瓷基片可以看出,陶瓷表面越粗糙,它就越可能失效。也就是说,弯曲时陶瓷间发生破裂。他们注意到有一个大约为6.75磅
Although several surface treatments have increased the bond between copper and ceramic, the most promising is the use of molten NaOH - based on the inventions of JGAmeen, AW Gillis, CESamuelson, and GP Vlask - all of whom are IBM company’s. In a ten-day experiment, they examined each procedure (invented by G.V. Elmore) and confirmed some of their more important properties. Their experiments showed that ceramic substrates impregnated with molten NaOH and then electroplated with standard electroless and electrolytic processes increased the bond strength of copper to ceramic from 2.75 pounds to over 8 pounds. Examining the ceramic substrate treated in NaOH and subjected to a bending test shows that the rougher the ceramic surface, the more likely it is to fail. In other words, breakage occurs between ceramics during bending. They noticed there was an approximate 6.75 lbs