在焊接CMOS集成电路和MOS场效管时,要求电烙铁外壳不能带电或感应电,所以常常来回插拔电烙铁插头,利用余热来进行焊接,速度越快越好,操作起来十分烦锁。还有一个问题,当电压下降到180V左右时,50W的内热式电烙铁很难熔化焊锡。为此笔者在这里介绍一种免插拔的移动式温控电烙铁支架,只 When soldering CMOS integrated circuits and MOSFETs, it is required that the electric soldering iron housing can not be charged or inducted, so the soldering iron plug is often plugged back and forth and the waste heat is used for welding. The faster the better, the more troublesome to operate. There is also a problem, when the voltage dropped to about 180V, 50W of internal thermal soldering iron is difficult to melt solder. To this end I introduce a kind of free-removable mobile temperature control electric iron bracket, only