电子设备内部的热量往往要耗散到外部周围环境中去,因此,通常需要对机箱外壳表面的温度进行估算。如果在电子设备试样阶段就进行估算,可以避免生产设计阶段出现的外壳和内部元件温度太高的现象。现有一种交互式BASIC计算机程序,它 The heat inside an electronic device tends to dissipate to the outside environment, so it is often necessary to estimate the temperature of the surface of the enclosure shell. If the electronic equipment in the sample stage to estimate, to avoid the production design phase appear shell and internal components temperature is too high phenomenon. There is an interactive BASIC computer program, it