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粗化铜箔抗热变色性能是印刷电路板用铜箔的重要性能之一。为提高抗热变色性能,采用化学钝化方法进行了试验研究,结果表明,在Zn-Cr-OH混合液中经电化学钝化处理,铜箔表面形成保护膜,抗热变色能力明显提高。
Coarse copper foil heat resistance is one of the important properties of copper foil for printed circuit boards. In order to improve the resistance to heat discoloration, the chemical passivation method was used to study the experimental results. The results showed that the protective film formed on the surface of copper foil by electrochemical passivation in Zn-Cr-OH mixture improved the resistance to thermal discoloration.