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为了对热电热泵进行优化设计,使输入功率最小,首先必须很好地计算热负荷。感温部件的温度冷却到等于或低于233K(-40℃)需要使用多级热电式热泵。在这种条件下,制冷系数 COP 与冷端温度 T的关系式表明,热负荷计算的任何微小误差会引起输入功率大的误差.本文讨论热负荷和输入功率相对于冷端温度的关系。可以用图解法计算一些实例的热负荷并表示对输入功率的影响。这些典型的例子是:(1)把多元件红外检测器组件冷却到193K(-80℃),(2)把单元件的硅激光传感器冷却到163K(-110℃),(3)把自动扫描组件芯片在氙中冷却到233K(-40℃)。每个例子在计算热负荷和输入功率的需求方面都有各自的特殊问题。
In order to optimize the thermoelectric heat pump design to minimize the input power, the heat load must first be well calculated. Cooling of the temperature sensing member to equal to or lower than 233K (-40 ° C) requires the use of a multistage thermoelectric heat pump. Under these conditions, the relationship between the COP and the cold junction temperature T shows that any small error in the thermal load calculation can cause a large error in the input power.This paper discusses the relationship between heat load and input power versus the cold junction temperature. The thermal load of some examples can be calculated graphically and expressed as the effect on input power. These typical examples are: (1) cooling the multi-element infrared detector assembly to 193K (-80 ° C), (2) cooling the single-piece silicon laser sensor to 163K (-110 ° C), (3) The component chip is cooled down to 233K (-40 ° C) in xenon. Each example has its own particular problem in terms of the requirements for calculating thermal load and input power.