英特尔、AMD、TI、Infineon、台联电(UMC)和台积电(TSMC)公司都纷纷表示,2003年将投产90nm 工艺,其日程表见表,大部分公司先在200mm 晶圆上试产,然后在300mm 晶圆上投产。目前90nm 工艺主要用于微处理器和逻辑器件,用于微处理器没有争议,因为批量大;用于逻辑器件的争议较多,因为种类多、批量少,在经济上是否划得来。目 Intel, AMD, TI, Infineon, UMC and TSMC have all said that the 90nm process will be put into operation in 2003. The schedule is shown in the table. Most of the companies piloted the 200mm wafer and then Put into production on 300mm wafer. The current 90nm process is mainly used for microprocessors and logic devices, for the microprocessor is not controversial, because the batch is large; more controversial for logic devices, because of the variety, batch volume, economically affordable. Head