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本文主要介绍了一种用国际通用的TO-8型管壳封装超小型混合集成放大器(尺寸为φ12mm)。该放大器采用集总参数的设计原理,直接把GaAs FET管芯和半导体MOS电容装架在一个(7×7mm)微晶玻璃片上,利用薄膜工艺技术,在微晶玻璃片上做有微波匹配电路。这祥,就做成了一种类似单片电路的超小型混合集成放大器。另外还介绍了由于小型化的管壳封装。几十个元件挤在一起,在电路版图设计中和在微细加工中,如何克服元件之间的相互影响,以及在装架中所应注意的微细加工的细节。文章最后给出了调试结果,F=300～1500M,G_p≥20dB,N_F≤1.7dB。该放大器性能指标国内领先,受到用户好评。
This article mainly introduces an ultra-small hybrid integrated amplifier (size: φ12mm) packaged with TO-8 tube package. The amplifier uses the lumped parameter design principle, the GaAs FET die and semiconductor MOS capacitor mounted directly on a (7 × 7mm) glass-ceramics, the use of thin-film technology, made in the glass-ceramic microwave matching circuit. This is the Cheung, it made a similar monolithic hybrid circuit integrated amplifier. Also introduced due to the small size of the package. Dozens of components come together in the circuit layout design and in microfabrication, how to overcome the interaction between the components, as well as the details of the micro-machining should pay attention to in the rack. Finally, the article gives the debugging results, F = 300 ~ 1500M, G_p≥20dB, N_F≤1.7dB. The amplifier performance leading domestic leader, praised by users.