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利用自行设计的超音速雾化制粉装置制备了无铅焊锡合金粉。研究了不同成分对雾化粉末特性的影响,同时观察了无铅焊锡雾化粉末钎焊接头的组织,并与传统含铅合金做了对比。结果表明:在相同过热度下,在3种不同成分的粉末中,Sn3Ag2.8Cu粉末具有最高的有效雾化率、最低的氧含量、最好的球形度和最光滑的表面;Sn3Ag2.8Cu焊锡膏与铜基板形成的扩散层比Sn3Ag2.8Cu-0.1Ce和Sn37Pb焊锡膏与铜基板的扩散层更厚,且形成的金属间化合物更不规则;Sn3Ag2.8Cu-0.1Ce粉末有效雾化率和氧含量均高于Sn37Pb。
The lead-free solder alloy powder was prepared by using a self-designed supersonic atomization milling device. The effects of different components on the properties of atomized powders were studied. The microstructure of the joints of lead-free solder atomized powders was observed and compared with the conventional lead-containing alloys. The results show that Sn3Ag2.8Cu powder has the highest effective atomization rate, the lowest oxygen content, the best sphericity and the smoothest surface among the three kinds of powders with the same degree of superheat. Sn3Ag2.8Cu solder The diffusion layer formed by the paste and the copper substrate is thicker than that of the Sn3Ag2.8Cu-0.1Ce and Sn37Pb solder paste and the copper substrate, and the intermetallic compounds formed are more irregular. The effective atomization rate of Sn3Ag2.8Cu-0.1Ce powder and Oxygen content is higher than Sn37Pb.