富士通株式会社近日宣布将在位于日本中部三重县的富士通三重半导体工厂内建立第二个300毫米晶圆厂,新厂将采用最先进的65纳米工艺技术和300毫米的晶圆大批量生产逻辑半导体。这个厂拥有双层洁净室结构,计划在2006年度内建成,并将于2007年4月投入运营,预计于2007年7月起开始批 Fujitsu Limited recently announced that it will establish a second 300mm wafer fab at its Fujitsu Mie semiconductor plant in Mie Prefecture, in central Japan. The new plant will use state-of-the-art 65nm process technology and 300mm wafer high-volume production of logic semiconductors . The plant has a double-decker cleanroom structure and is scheduled to be completed in 2006 and will be operational in April 2007 and is expected to begin operation in July 2007