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在装配半导体仪器时,连接黄金导线与镍是重要的工序。用激光焊接能合理地解决这个问题,同时因为局限于加热,没有电流流过零件,对仪器没有热作用和机械作用。在电焊研究所里,在CДC-10装置上进行了黄金导线(?)50微米与圆面((?)200微米)和平面(200×800微米)的镍导体的激光焊接的实验和加工工艺。事先将黄金导线在镍圆形导体上绕二三匝,然后将激光辐射聚焦在这些线圈上。借助于机械试验,以及金相分析来直观地实现焊接区焊接接头检查。当机械试验时,在绝大多数情况下,焊接接头沿黄金导线
When assembling semiconductor instrumentation, it is important to connect the gold wire with nickel. With laser welding can solve this problem reasonably, and because limited to heating, no current flowing through the parts, the instrument has no thermal effects and mechanical effects. At the Welding Institute, experiments and processing were performed on the CДC-10 apparatus for laser welding of gold conductors (50 μm) with nickel conductors of circular (200 μm) and planar (200 × 800 μm) . The gold wire is wound two or three turns on a nickel circular conductor in advance and then the laser radiation is focused on these coils. Through the mechanical test, and metallographic analysis to visually achieve the weld zone weld inspection. When mechanical testing, in the vast majority of cases, welded joints along the gold wire