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目的:针对半导体硅片目前暂无适用有效国家标准的现状,研究半导体级硅片的弯曲强度测试方法,为硅片的产线工艺设计提供依据。方法:通过对比分析已过期失效的硅片弯曲强度国标测试方法和性能近似的瓷性材料弯曲强度测试方法,选择四点弯曲法进行硅片弯曲强度试验。测试结果表明该方法重复精度高,适于半导体级硅片产品弯曲强度测试,测试数据可为半导体级硅片的产线工艺设计提供依据。
OBJECTIVE: To investigate the current situation of no applicable national standards for semiconductor wafers, the test method for the flexural strength of semiconductor wafers is studied to provide the basis for the design of the wafer production process. Methods: The flexural strength of silicon wafers was tested by four-point bending method through the comparative analysis of the GB test method and the flexural strength test method of porcelain materials with expired failure. The test results show that the method is highly repeatable and suitable for the flexural strength testing of semiconductor grade wafer products. The test data can provide the basis for the design of the production line of semiconductor grade silicon wafer.