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随着电子工业的发展,对半导体、接插件、印刷线路板的镀层测厚技术要求越来越高。特别是对贵金属镀层的厚度测量,要求速度快、准确度高而且不受零件形状和尺寸的限制。X光荧光镀层测厚仪就是为适应上述要求而发展的非破坏性的,非接触式的镀层厚度测量仪器。美国康乐博览统筹公司在北京举办展览会期间,美国UPA公司就X光荧光测厚技术
With the development of the electronics industry, the requirements for coating thickness measurement of semiconductors, connectors and printed circuit boards are getting higher and higher. Especially for the thickness of the precious metal coating measurement requirements of speed, high accuracy and not subject to the shape and size constraints. X-ray fluorescence coating thickness gauge is to meet the above requirements and the development of non-destructive, non-contact coating thickness measurement instruments. American Leisure Expo co-ordination company held in Beijing during the exhibition, the United States UPA company X-ray fluorescence thickness measurement technology