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本文介绍我们采用聚酰亚胺与溅射SiO_2双层介质进行表面钝化的研究.这种技术克服了单一聚酰亚胺介质层进行表面钝化时难于微细加工的缺点,以其特有的流平性、与金属层良好的粘附性而成为集成电路表面钝化及多层布线的新途径.
This article presents our research on surface passivation using polyimide and sputtered SiO 2 double-layer media, which overcomes the drawbacks that a single polyimide layer is difficult to microfabricate when it is surface passivated, with its unique flow Flatness, good adhesion with the metal layer and become a new way of passivation and multilayer wiring of integrated circuit surface.