一、基板材料 薄膜电路早先采用的基板材料有玻璃、氧化硅、涂釉氧化铝、闪光氧化铝、抛光氧化铝、氧化铍和兰宝石等。近几年来,由于薄膜技术的发展以及薄膜混合IC对元件的要求不断提高,新的基板材料也不断出现,如硅片、绝缘金属基板、珐琅基板、聚酰亚胺和聚四氟乙烯塑料基板等等。 First, the substrate material film circuit Previously used substrate materials are glass, silicon oxide, coated glaze alumina, flash alumina, polished alumina, beryllium oxide and sapphire. In recent years, due to the development of thin film technology and thin film hybrid IC components continue to increase, new substrate materials are also emerging, such as silicon, insulating metal substrate, enamel substrate, polyimide and polytetrafluoroethylene plastic substrate and many more.