论文部分内容阅读
采用先球磨混粉后进行放电等离子烧结(SPS)的工艺制备了CuCr25/石墨烯触头材料.对烧结前的混粉和烧结后的试样进行了XRD衍射分析,对比XRD衍射图谱未见有铬的碳化物生成,且少层石墨烯性状并未发生改变.金相分析实验表明,Cu与Cr 2相组织彼此分布均匀,尺寸细小.通过SEM的形貌观察以及EDS和电子探针的面扫描分析显示:石墨烯在所制备的CuCr25/石墨烯新型合金中具有良好的分散性.显微硬度及电导率测量的研究结果表明,上述工艺制备的CuCr25/石墨烯合金与同种方法制备的CuCr25合金相比,前者硬度提高了30%,而电导只略有下降;与传统工艺制备的CuCr50合金相比,前者硬度与后者相当,但电导率则显著提高了近50%.
The CuCr25 / graphene contact materials were prepared by ball milling and powder sintering followed by spark plasma sintering (SPS). The XRD results of XRD before and after sintering showed that there was no XRD diffraction pattern Chromium carbides were formed and the properties of few layers of graphene did not change.The results of metallographic analysis showed that the microstructures of Cu and Cr 2 were evenly distributed and the sizes were small.The morphologies of Cu and Cr 2 were observed by SEM and that of EDS and electron probe Scanning analysis shows that graphene has good dispersibility in the novel CuCr25 / graphene alloy prepared by the above method, and the results of microhardness and conductivity measurement show that the CuCr25 / graphene alloy prepared by the above process and the same method CuCr25 alloy compared to the former hardness increased by 30%, while the conductivity decreased only slightly; compared with the traditional preparation of CuCr50 alloy, the former hardness comparable with the latter, but the conductivity was significantly increased by nearly 50%.