随着汽车、太空、医学与工业等产业开始采用复杂芯片,加上电路板或系统单芯片(SoC)为了符合市场需求而加入更多功能,让芯片热效应已成为半导体与系统设计时的一大问题。据Semiconductor Engineering报导,DfR Solutions资深工程师指出,随着芯片与电路板越来越小,让热问题显得更加严重。Ansys副总则指出,热会带来一堆无法预知的变化,让业者必须从芯片封装或系统层次评估热冲击的程度, As the automotive, space, medical and industrial industries begin to adopt complex chips, plus circuit boards or system-on-chips (SoCs) to add more power to meet market requirements, the chip thermal effects have become a big part of semiconductor and system design problem. According to Semiconductor Engineering reports, DfR Solutions senior engineer pointed out that with smaller and smaller chips and circuit boards, so that the heat problem is even more serious. Ansys Deputy General Manager pointed out that the heat will bring a bunch of unpredictable changes, so that industry must assess the extent of thermal shock from the chip package or system level,