覆铜板(CCL)和半固化片(PP)是印制电路板(PCB)的基础材料,由其决定了PCB的基本特性。然而,CCL和PP之性能也是由其材料与结构决定。CCL构成主体是导体铜箔、粘合树脂和增强物,此外还有固化促进剂、阻燃剂和填料等成分,都会影响到CCL和PP之性能,并延伸至PCB的性能。本期主题基材,所 CCLs and prepregs (PP) are the basic materials used in printed circuit boards (PCBs), which determine the basic characteristics of a PCB. However, the properties of CCL and PP are also determined by their material and structure. CCL is composed of conductor copper foil, bonding resin and reinforcement, in addition to curing accelerator, flame retardant and filler and other ingredients, will affect the performance of CCL and PP, and extends to the performance of the PCB. The current theme of substrate, the