随着电子设备用零部件标准的制定,混合集成电路的使用范围一直在快速拓展。此类高性能高封装密度组件日益改进革新,需求日益扩大。 混合集成电路(HIC),作为电子设备小型轻量化的途径,紧随电子设备的进展步伐,日益完善。HIC从其发展的早期阶段就已显示了多方面的特点,诸如不要求变更印制电路板,比LSI芯片开发周期短,以及焊点较少,可靠性好等 With the development of standard parts for electronic equipment, the scope of use of hybrid integrated circuits has been rapidly expanding. The demand for such high-performance, high-packing density components is constantly improving and innovating. Hybrid Integrated Circuits (HICs), as a way to miniaturize and lightweight electronic devices, have been perfected following the progress of electronic devices. HIC has shown many aspects from its early stages of development, such as not requiring a change to a printed circuit board, shorter development cycles than an LSI chip, fewer solder joints and good reliability