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本文研究了主要成分为5-甲基-2-戊基二硫代-1,3,4-噻二唑的复配型缓蚀剂TSJ-T6,在浓度为5.0×10-5g/g的H2S中对银的缓蚀性能。通过增重实验、接触角分析、电化学极化曲线测试以及分子动力学模拟研究了该缓蚀剂的缓蚀效率及缓蚀机理。增重实验结果证明,缓蚀剂TSJ-T6对银片在H2S中的腐蚀具有良好的缓蚀效果,缓蚀剂浓度为2.5×10-5g/g时,缓蚀效率高达94.51%。接触角分析结果表明,该缓蚀剂分子在银片和腐蚀液的界面形成了一层疏水保护膜。极化曲线结果表明,缓蚀剂TSJ-T6的存在降低了阴、阳极的塔菲尔斜率,为混合型缓蚀剂;同时,该缓蚀剂的存在显著降低了腐蚀电流密度,表明该缓蚀剂对银片在H2S中的腐蚀有良好的缓蚀效果。分子动力学模拟表明,缓蚀剂分子通过噻二唑环和链上的硫、氮原子吸附在银表面,烷基链则以一定角度指向溶液。
In this paper, the main component of 5-methyl-2-pentyl dithio-1,3,4-thiadiazole compound corrosion inhibitor TSJ-T6, at a concentration of 5.0 × 10-5g / g of Corrosion inhibition of silver in H2S. The corrosion inhibition efficiency and corrosion inhibition mechanism of the inhibitor were studied by weight gain experiment, contact angle analysis, electrochemical polarization curve test and molecular dynamics simulation. The results of weight gain experiment showed that corrosion inhibitor TSJ-T6 has a good corrosion inhibition effect on the corrosion of silver flake in H2S. When the concentration of corrosion inhibitor is 2.5 × 10-5g / g, the corrosion inhibition efficiency is as high as 94.51%. Contact angle analysis results show that the corrosion inhibitor molecules form a hydrophobic protective film at the interface between silver flake and etching solution. The results of polarization curves show that the presence of corrosion inhibitor TSJ-T6 decreases the Tafel slope of the anodic and anodic electrodes and is a mixed corrosion inhibitor. At the same time, the presence of corrosion inhibitor significantly reduces the corrosion current density, Etch on the silver in the H2S corrosion has a good corrosion inhibition. Molecular dynamics simulations show that the corrosion inhibitor molecules adsorb on the silver surface through the thiadiazole ring and the sulfur and nitrogen atoms in the chain, while the alkyl chains point to the solution at an angle.