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随着现代电子技术快速发展,电子设备集成度不断提升。随着集成度快速提升,功耗也随之不断增大,大量功耗带来了大量的热流密度。特别针对警报器设备由于工作环境差,工作时间长,工作环境复杂等情况,一旦工作温度上升到电子元件极限温度就会使电子设备出现大量故障,降低电子设备的工作稳定性。针对这现象,根据警报器功放元件的工作行为模式,进行了几点相应研究:(1)对现有警报器以及其他相应电子设备结构的现代设计分析手段进行相应研究,总结不同方法的优缺点并为警报器功放元件的热分析奠定相应的理论基础;(2)对现有热分析研究方法进行相应的理论研究,并结合警报器功放元件工作温度上升方式进行相应的理论结合,研究出适合警报器功放元件的热分析方法;(3)利用相应有限元软件建立温度场模型,利用有限元分析技术对功放元件进行相应的热分析研究。
With the rapid development of modern electronic technology, electronic equipment integration continues to improve. With the rapid increase in integration, power consumption will also continue to increase, a large number of power consumption has brought a lot of heat flux density. Especially for the alarm device due to poor working conditions, long working hours, complex working environment, once the working temperature rises to the limit temperature of electronic components, it will cause a large number of failures of electronic equipment and reduce the stability of electronic equipment. Aiming at this phenomenon, some researches are made according to the working behavior patterns of the components of the sounder of the siren: (1) To make corresponding researches on the modern design and analysis methods of the existing siren and other corresponding electronic equipment structures, and to sum up the advantages and disadvantages of different methods And provide the theoretical basis for the thermal analysis of the components of the siren amplifier. (2) Carry on the corresponding theoretical research to the existing thermal analysis research method, combine the corresponding theory combination with the rising of the operating temperature of the sounder element of the siren, (3) Using the corresponding finite element software to establish the temperature field model, using the finite element analysis of the power amplifier components for the corresponding thermal analysis.