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高性能、低成本的微波组件制造技术对复杂昂贵的电子系统的普及应用具有重要意义。目前 ,微波组件多采用薄膜或微波介质片工艺制造 ,其调试靠手工操作来完成 ,制造成本较高 ,生产一致性差。先进的铜厚膜工艺具有微波性能好、便于大批量生产等特点 ,是一种高性能、低成本的电路基板制造技术。激光技术与自动测试技术、自动控制技术相结合可实现对微波组件的高精度动态闭环自动化测试修调。采用这些先进技术 ,能提高生产效率 ,降低微波组件的制造成本。
High-performance, low-cost manufacturing of microwave components is of great importance for the popularization and application of complex and expensive electronic systems. At present, the microwave components are mostly manufactured by using a film or a microwave dielectric sheet process. The debugging is performed by manual operation, the manufacturing cost is higher, and the manufacturing consistency is poor. Advanced copper thick film process with microwave performance, ease of mass production and other characteristics, is a high performance, low cost circuit board manufacturing technology. Laser technology and automatic test technology, automatic control technology can be combined to achieve high-precision dynamic microwave components closed-loop automated testing trimming. Adopting these advanced technologies can increase the production efficiency and reduce the manufacturing cost of microwave components.