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用电化学方法研究了铜在3％NaCl溶液中活性区的溶解机制.铜在活性区是以CuCl形式溶解的,并受它的扩散过程控制.文中提出了溶解的动力学机制.恒电流实验表明,在实际电解过程中钢是以亚铜离子的形式到达被保护表面的.“,”To understand the application of copper for anti-fouling the dissolution mechanism of copper was investigated in 3% NaCl solution by means of potentiodynamic polarization and electrochemical impedance spectroscopy as well as cyclic voltammetry. Copper in active region dissolved in the form of CuCl2, complex,and the rate of dissolution was controlled by its diffusion from the copper surface to the bulk of the solution. The kinetics mechanism of copper dissolution in active region was suggested. The galvanostatic experiments showed that copper was electrolyzed and than transferred to the surface to be protected against fouling in the form of cuprous species, and that the divergent reaction of cuprous ions to cupric ions had not been found.