论文部分内容阅读
针对新型免修整柔性砂轮高效和消振的特性 ,将其应用于半导体石英基板材料的磨削加工。实验采用大进给和深切进给的高能率磨削方式 ,研究新型砂轮对于硬脆材料的磨削性能
For the new type of dressing-free flexible wheel vibration and vibration-absorbing features, its application to the semiconductor quartz substrate material grinding. Experiments using large feed and deep feed high-energy grinding methods to study the new grinding wheel for hard and brittle material grinding performance