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采用粉末冶金法制备了以Ti2AlN和La2O3为增强相的新型铜基复合材料。研究了Ti2AlN与Cu界面反应及其对复合材料性能的影响。结果表明:Ti2AlN颗粒化学镀铜后改善了铜与Ti2AlN的界面结合情况,形成了宽度为20 nm左右的过渡区。在880~940℃的烧结温度范围内,增强相与基体的界面发生化学反应,生成了Cu(Al)固溶体与TiNx,在显著提高复合材料强度的同时,降低材料的导电性。另外,La2O3纳米颗粒分布在铜基体内,对材料起到弥散强化的作用。
A new copper matrix composite with Ti2AlN and La2O3 as reinforcing phases was prepared by powder metallurgy. The interfacial reaction between Ti2AlN and Cu and its effect on the properties of composites were studied. The results show that Ti2AlN particles improve the interfacial bonding between copper and Ti2AlN after electroless copper plating, and a transition zone with a width of about 20 nm is formed. During the sintering temperature range from 880 ℃ to 940 ℃, Cu (Al) solid solution and TiNx were formed due to the chemical reaction at the interface between the reinforcing phase and the matrix, which markedly enhanced the strength of the composite and decreased the electrical conductivity of the composite. In addition, La2O3 nanoparticles distributed in the copper matrix, the material played the role of dispersion strengthened.