论文部分内容阅读
主要研究了65 nm碱性铜布线的平坦化工艺。对不同尺寸铜线条进行抛光,讨论了抛光压力、抛光液流量和转速对平坦化的影响。结果表明,压力是影响平坦化的主要因素;分别改变压力、流量或转速时,窄线条的平坦化效果优于宽线条;平坦化效果随着压力的减小逐渐变好,即压力为1.0 psi(1 psi=6.895 kPa)时,平坦化效果最好;抛光液流量在300 mL/min时,化学反应和机械作用都达到饱和,平坦化效果最佳;平坦化效果随着转速的提高逐渐变好,转速在100 r/min时,保证了质量传递效率,所有铜线条都达到了最好的平坦化。
The main research of 65 nm alkaline copper wiring planarization process. Polishing copper wires of different sizes, the effects of polishing pressure, polishing fluid flow rate and rotation speed on the planarization were discussed. The results show that the pressure is the main factor that affects the planarization. When the pressure, the flow rate or the rotational speed are respectively changed, the flattening effect of the narrow line is better than that of the wide line; the flattening effect gets better as the pressure decreases, that is, the pressure is 1.0 psi (1 psi = 6.895 kPa), the flattening effect is best. When the polishing liquid flow rate is 300 mL / min, the chemical reaction and the mechanical action are saturated, and the flattening effect is best. The flattening effect gradually changes with the increase of the rotating speed Good, the speed of 100 r / min, to ensure the quality of transfer efficiency, all the copper lines have reached the best flatten.