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自1994年以来,两年一届的电子封装技术国际会议(ICEPI)分别在中国北京、上海和深圳等地成功召开过六届。作为唯一由中国政府,权威机构,业内主导所组织和支持的电子封装技术会议,每届都吸引了大批的国内外高校、研究机构、封装组装制造厂商、封装测试组装设备厂商、封装组装材料厂商踊跃参加,人数每次都超过400位,包括来自近20个国家和地区的国外专家、学者和企业家等。会议议题主要集中在封装设计、封装制造、封装测试、以及LED封装、MEMS封装、系统及组装等领域。这是唯一由中国政府和相关业界发起的国内最高水平、最大规模的关于电子封装组装和测试技术的学术会议,必将成为先进封装技术交流的大平台。第七届电子封装技术国际学术会议将在中国金融中心上海举行,敬邀您的参与。会议相关内容说明如下：
Since 1994, the biennial International Conference on Electronic Packaging Technologies (ICEPI) has successfully held six sessions in Beijing, Shanghai and Shenzhen respectively. As the only electronic packaging technology conference organized and supported by the Chinese government, authoritative institutions and industry leaders, each session attracts a large number of domestic and foreign universities, research institutes, packaging assembly manufacturers, packaging and testing assembly equipment manufacturers, packaging and assembly materials manufacturers More than 400 participants attended each time, including foreign experts, scholars and entrepreneurs from nearly 20 countries and regions. Meeting topics focused on packaging design, packaging manufacturing, packaging and testing, and LED packaging, MEMS packaging, systems and assembly and other fields. This is the only academic conference sponsored by the Chinese government and related industries with the highest level and largest scale in electronic package assembly and testing technology. It will surely become a platform for exchange of advanced packaging technologies. The Seventh International Symposium on Electronic Packaging Technology will be held in Shanghai, China’s financial center, and we sincerely invite your participation. The relevant content of the meeting is described as follows: