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研究了镁合金直接化学镀镍活化后表面状态对镀速的影响,结果表明,活化后表面FO比值较小时,镀速较快。这种现象与氧化镁在镀液中的溶解造成较多的基底与镀液中镍离子的置换反应有关。
The effect of surface condition on the plating rate after direct electroless nickel plating activation was studied. The results show that the plating rate is faster when the surface FO ratio is smaller after activation. This phenomenon and the dissolution of magnesium oxide in the plating solution cause more substrate replacement reaction with nickel ions in the plating solution.