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采用一浴法对铜进行了热浸镀镀铝试验,热浸镀时间为8s,热浸镀温度为690~740℃。研究了热浸镀温度对Cu/Al复合材料组织、导电性能及结合性能的影响,采用扫描电子显微镜(SEM)和偏光显微镜(PM)观察双金属结合界面金相组织形貌,用能谱仪(EDS)进行化学成分分析,用X射线衍射仪(XRD)进行物相分析。结果表明:随着热浸镀温度的升高,Cu/Al复合材料导电性能迅速降低;结合性能出现先升高后降低的趋势。在热浸镀温度为710℃、热浸镀时间为8s的条件下,Cu/Al复合材料过渡层的金属间化合物晶粒比较小而且分布较均匀,相比温度升高获得的粗大晶粒而言更有弥散强化优势,并且有利于应力的缓解释放,此时Cu/Al复合材料结合强度最高,达到了最大的16MPa,过渡层内形成了良好的结合界面;Cu/Al复合材料界面主要生成了CuAl2,CuAl,Cu9Al4,K3AlF6等化合物,但金属间化合物过多会对缺陷比较敏感,易产生裂纹,严重影响Cu/Al复合材料的导电性和结合性。Cu/Al复合材料的界面结构为Cu/Cu-Al化合物+Cu基固溶体/Al-CuAl2共晶组织+Cu-Al化合物+Al基固溶体/Al。
One-bath method was used to test the hot-dip aluminizing of copper. The hot-dip time was 8s and the hot-dip temperature was 690 ~ 740 ℃. The effects of hot dipping temperature on the microstructure, electrical conductivity and bonding properties of Cu / Al composites were studied. The morphology of bimetal bonding interface was observed by scanning electron microscopy (SEM) and polarized light microscope (PM) (EDS) for chemical composition analysis and phase analysis by X-ray diffraction (XRD). The results show that the electrical conductivity of Cu / Al composites decreases rapidly with the increase of hot-dip temperature, and the bonding properties first and then decreases. Under the conditions of hot-dip temperature of 710 ℃ and hot-dip time of 8s, the intermetallic compound grains in the Cu / Al composite transitional layer are relatively small and evenly distributed. Compared with the coarse grains obtained by the temperature increase Cu / Al composite material at this time the highest bonding strength, reaching the maximum of 16MPa, the transition layer formed a good bonding interface; Cu / Al composite interface is mainly generated CuAl2, CuAl, Cu9Al4, K3AlF6 and other compounds, but too much intermetallic compounds will be more sensitive to defects, easy to produce cracks, seriously affecting the Cu / Al composite conductivity and binding. The interface structure of Cu / Al composite is Cu / Cu-Al compound + Cu-based solid solution / Al-CuAl2 eutectic structure + Cu-Al compound + Al-based solid solution / Al.