论文部分内容阅读
本文研究了化学镀铜中各种添加剂的作用。对某些含氮基化合物、含氧基化合物、含硫基化合物作为添加剂进行了实验。从实验结果比较了镀液稳定性、析出速度、镀层厚度等特性。从而得出含硫基化合物、含氮基化合物作为添加剂时镀液稳定性好,它们可能和铜离子形成络合物或螯合物,并做了两种添加剂配合使用的镀液稳定性和析出速度实验。另外还探讨了关于添加剂添加量、镀液温度、镀覆时间、镀膜厚度等条件的相互关系。
This paper studies the role of various additives in electroless copper plating. Some nitrogen-containing compounds, oxygen-containing compounds, sulfur-containing compounds as additives were tested. The experimental results compare the bath stability, deposition rate, coating thickness and other characteristics. Thus, the sulfur-containing compounds, nitrogen-containing compounds as additives when the bath stability, they may form complexes with copper ions or chelates, and made two additives used in bath stability and precipitation Speed experiment. In addition, it also discusses the relationship between additive amount, bath temperature, plating time, coating thickness and other conditions.