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针对弹载微波/毫米波组件的应用环境特点,重点分析了MMIC裸芯片密封、“三防”、静电防护、组件电源干扰抑制以及小型化设计等几个方面的工程问题。提出了一种射频通道波导微带过渡和MMIC器件气密封装结构一体化设计改进方案,减小了插损,降低了噪声系数。分析了几种射频电路静电防护和电源干扰抑制的措施,总结了工程中射频组件小型化的几个实施方案。
According to the characteristics of application environment of the onboard microwave / millimeter wave module, the engineering problems of several aspects such as MMIC bare chip encapsulation, ESD protection, ESD protection, component power supply interference suppression and miniaturization design are analyzed emphatically. An improved scheme of integrated design of RF channel waveguide microstrip transition and airtight packaging structure for MMIC devices is proposed, which reduces the insertion loss and reduces the noise figure. Several measures of ESD protection and power supply interference suppression of RF circuits are analyzed. Several implementation schemes of miniaturization of RF components in the project are summarized.