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引言 胶接结构具有许多独特的优点,因此胶接新工艺正在得到日益广泛的应用。对胶接质量无损检测方法及设备的研究与应用已引起人们的普遍重视,并已发展成为一种多学科的无损检测分支。我厂目前在这方面试验与应用的有敲击法、声阻探伤、液晶探伤、激光全息照相和胶接强度检测仪等。前四种方法仅可定性地检测胶接质量,即检测胶脱伤。最后一种方法可定量地检测胶接内聚强度。还有X光透视,可用于检查蜂窝格子失稳和节点脱开等缺陷,直
Introduction Bonding structures have many unique advantages, so the new bonding technology is gaining more and more widespread use. The research and application of nondestructive testing methods and equipment for the quality of adhesive bonding have drawn people’s universal attention and have developed into a multidisciplinary nondestructive testing branch. I plant in this area are tested and applied percussion method, acoustic resistance testing, liquid crystal inspection, laser holographic and bonding strength tester. The first four methods can only qualitatively test the quality of the glue, that is, test the glue to remove the wound. The last method quantifies the adhesive cohesive strength. There X-ray, can be used to check the cellular lattice instability and node defects such as defects, straight