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近年来,随着电子部件高性能化、高产量化和省力化的实现,其小型化的工作也正在开展,特别是,由于半导体元件和集成电路方面技术革新的惊人发展,各有关部门还要求进一步降低成本。 作为半导体仪器用导线框材料,在铜基合金中,以前一直使用着CDA(Cu—2.3Fe—0.1Zn—0.03P)或锡铜。 这些合金各具有自身的特性,在重视强度和耐热性的场合,可选用CDA194;在强调导
In recent years, miniaturization of electronic components has been under way with the achievement of high performance, high-yielding and labor-saving electronic components. In particular, due to the astonishing development of technological innovations in semiconductor components and integrated circuits, various departments are required to further cut costs. As a lead frame material for semiconductor devices, CDA (Cu-2.3Fe-0.1Zn-0.03P) or tin-copper has been conventionally used in copper-based alloys. Each of these alloys has its own characteristics, in the emphasis on strength and heat resistance of the occasion, the choice of CDA194; in the emphasis on guidance