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英飞凌科技发表新一代薄晶圆技术IGBTTRENCHSTOP5系列产品,其导通损失和切换损失均远低于目前的解决方案。透过这项突破性的产品,英飞凌为IGBT效能立下新标竿,继续在效率需求不断提升的市场中保持领先地位。新技术的崩溃电压提高至650V,让设计拥有更高的安全余裕。目标拓朴为PFC(AC/DC)升压级和高电压DC/DC拓朴,常见于光伏逆变器、不断电系统(UPS)和变频焊接机具等应用。
Infineon Technologies released a new generation of thin wafer IGBTTRENCHSTOP5 series products, the conduction loss and switching losses are far lower than the current solution. Through this ground-breaking product, Infineon has set a new benchmark in IGBT performance and continues to lead the market in the ever-increasing demand for efficiency. The collapse of the new technology voltage to 650V, so that design has a higher safety margin. The target topology is PFC (AC / DC) boost and high voltage DC / DC topologies commonly found in applications such as photovoltaic inverters, UPSs, and inverter welding equipment.